Speaker: Professor Tianhong Cui; Richard & Barbara Nelson Associate Professor of Mechanical Engineering at the University of Minnesota.



Date: 17.06.2008
Time: 13:00
Room: 101-02-016/18

This talk presents the combination of “bottom-up” layer-by-layer (LbL) nano self-assembly and “top-down” micromanufacturing techniques for MEMS and electronics for potential biomedical applications. Two approaches were utilized to pattern nano self-assembled thin films effectively. With nano self-assembly and surface micromachining, highly flexible nanoparticle-based magnetic cantilever platform for micro sensing and actuation was fabricated successfully. Self-assembled magnetic thin films on polymeric tunneling sensors were functional as polymer actuators and highly sensitive sensors. For flexible electronics devices, self-assembled silica nanoparticle thin film acted as the dielectric layer for field-effect transistors. Nanoparticle- and polymer-based field-effect transistors with embedded self-assembled films as dielectric and active layers were fabricated and characterized successfully as well. These self-assembled field-effect transistors were primarily investigated for bio-sensing applications.

BIOGRAPHY: Tianhong Cui is currently the Richard & Barbara Nelson Associate Professor of Mechanical Engineering at the University of Minnesota. From 1995 to 2003, he held research or faculty positions at Tsinghua University, University of Minnesota, National Laboratory of Metrology in Japan, and Louisiana Tech University, respectively. He received his B.S. from Nanjing University of Aeronautics and Astronautics in 1991, and his Ph.D. with honors from Chinese Academy of Sciences in 1995.  
His current research interests include MEMS/ NEMS and nanotechnology. He has more than 100 publications in MEMS and nanotechnology including over 40 peer-reviewed journal papers for the last three years. His research has been sponsored by NSF, DARPA, NASA, DOE, etc. He received research awards including the Endowed Chair Professorship from the University of Minnesota, the Research Foundation Award from Louisiana Tech University, the Alexander von Humboldt Award in Germany, and the STA & NEDO fellowships in Japan. He is a senior member of IEEE and a member of ASME. He is serving as an associate editor for Journal of Nanoscience and Nanotechnology and Journal of Nano Research. (Link to the Website of Prof.  Tianhong Cui)


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