New wire bonded microtransformers published

Researchers of the microactuators laboratory have published a paper on novel 3D solenoidal on-chip wire bonded microtransformers in JMM.



The new paper “Wire bonded 3D coils render air core microtransformers competitive” has been published by Ali Moazenzadeh et al. in the Journal of Micromechanics and Microengineering. There, the researchers report on a novel wafer level fabrication method for 3D solenoidal microtransformers for very high frequency applications using an automatic wire bonder. The highlights include:

The paper is open access and free to download.


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